0306ZC102KAT4A [KYOCERA AVX]

Low Inductance Cap;


型号：	0306ZC102KAT4A
厂家：	KYOCERA AVX
描述：	Low Inductance Cap
文件：	总4页 (文件大小：308K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Low Inductance Capacitors

Introduction

The signal integrity characteristics of a Power Delivery

Network (PDN) are becoming critical aspects of board level

and semiconductor package designs due to higher operating

frequencies, larger power demands, and the ever shrinking

lower and upper voltage limits around low operating voltages.

These power system challenges are coming from mainstream

designs with operating frequencies of 300MHz or greater,

modest ICs with power demand of 15 watts or more, and

operating voltages below 3 volts.

capacitor, one resistor, and one inductor. The RLC values in

this model are commonly referred to as equivalent series

capacitance (ESC), equivalent series resistance (ESR), and

equivalent series inductance (ESL).

The ESL of a capacitor determines the speed of energy

transfer to a load. The lower the ESL of a capacitor, the faster

that energy can be transferred to a load. Historically, there

has been a tradeoff between energy storage (capacitance)

and inductance (speed of energy delivery). Low ESL devices

typically have low capacitance. Likewise, higher capacitance

devices typically have higher ESLs. This tradeoff between

ESL (speed of energy delivery) and capacitance (energy

storage) drives the PDN design topology that places the

fastest low ESL capacitors as close to the load as possible.

Low Inductance MLCCs are found on semiconductor

packages and on boards as close as possible to the load.

The classic PDN topology is comprised of a series of

capacitor stages. Figure 1 is an example of this architecture

with multiple capacitor stages.

An ideal capacitor can transfer all its stored energy to a load

instantly. A real capacitor has parasitics that prevent

instantaneous transfer of a capacitor’s stored energy. The

true nature of a capacitor can be modeled as an RLC

equivalent circuit. For most simulation purposes, it is possible

to model the characteristics of a real capacitor with one

Slowest Capacitors

Fastest Capacitors

Semiconductor Product

Bulk

Board-Level

Package-Level

Die-Level

Low Inductance Decoupling Capacitors

Figure 1 Classic Power Delivery Network (PDN) Architecture

LOW INDUCTANCE CHIP CAPACITORS

INTERDIGITATED CAPACITORS

The key physical characteristic determining equivalent series

inductance (ESL) of a capacitor is the size of the current loop

it creates. The smaller the current loop, the lower the ESL. A

standard surface mount MLCC is rectangular in shape with

electrical terminations on its shorter sides. A Low Inductance

Chip Capacitor (LICC) sometimes referred to as Reverse

Geometry Capacitor (RGC) has its terminations on the longer

side of its rectangular shape.

The size of a current loop has the greatest impact on the ESL

characteristics of a surface mount capacitor. There is a

secondary method for decreasing the ESL of a capacitor.

This secondary method uses adjacent opposing current

loops to reduce ESL. The InterDigitated Capacitor (IDC)

utilizes both primary and secondary methods of reducing

inductance. The IDC architecture shrinks the distance

between terminations to minimize the current loop size, then

further reduces inductance by creating adjacent opposing

current loops.

When the distance between terminations is reduced, the size

of the current loop is reduced. Since the size of the current

loop is the primary driver of inductance, an 0306 with a

smaller current loop has significantly lower ESL then an 0603.

The reduction in ESL varies by EIA size, however, ESL is

typically reduced 60% or more with an LICC versus a

standard MLCC.

An IDC is one single capacitor with an internal structure that

has been optimized for low ESL. Similar to standard MLCC

versus LICCs, the reduction in ESL varies by EIA case size.

Typically, for the same EIA size, an IDC delivers an ESL that

is at least 80% lower than an MLCC.

Low Inductance Capacitors

Introduction

LAND GRID ARRAY (LGA) CAPACITORS

LOW INDUCTANCE CHIP ARRAYS (LICA^®)

Land Grid Array (LGA) capacitors are based on the first Low

ESL MLCC technology created to specifically address the

design needs of current day Power Delivery Networks (PDNs).

This is the 3rd low inductance capacitor technology

developed by AVX. LGA technology provides engineers with

new options. The LGA internal structure and manufacturing

technology eliminates the historic need for a device to be

physically small to create small current loops to minimize

inductance.

The LICA^®product family is the result of a joint development

effort between AVX and IBM to develop a high performance

MLCC family of decoupling capacitors. LICA was introduced

in the 1980s and remains the leading choice of designers in

high performance semiconductor packages and high

reliability board level decoupling applications.

LICA^®products are used in 99.999% uptime semiconductor

package applications on both ceramic and organic

substrates. The C4 solder ball termination option is the

perfect compliment to flip-chip packaging technology.

Mainframe class CPUs, ultimate performance multi-chip

modules, and communications systems that must have the

reliability of 5 9’s use LICA^®.

LICA^®products with either Sn/Pb or Pb-free solder balls are

used for decoupling in high reliability military and aerospace

applications. These LICA^®devices are used for decoupling of

large pin count FPGAs, ASICs, CPUs, and other high power

ICs with low operating voltages.

The first family of LGA products are 2 terminal devices. A

2 terminal 0306 LGA delivers ESL performance that is equal

to or better than an 0306 8 terminal IDC. The 2 terminal 0805

LGA delivers ESL performance that approaches the 0508

8 terminal IDC. New designs that would have used 8 terminal

IDCs are moving to 2 terminal LGAs because the layout is

easier for a 2 terminal device and manufacturing yield is better

for a 2 terminal LGA versus an 8 terminal IDC.

LGA technology is also used in a 4 terminal family of products

that AVX is sampling and will formerly introduce in 2008.

Beyond 2008, there are new multi-terminal LGA product

families that will provide even more attractive options for PDN

designers.

When high reliability decoupling applications require the very

lowest ESL capacitors, LICA^®products are the best option.

470 nF 0306 Impedance Comparison

0306 2T-LGA

0306 LICC

0306 8T-IDC

0603 MLCC

0.1

0.01

0.001

100

1000

Frequency (MHz)

Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).

LGA Low Inductance Capacitors

0204/0306/0805 Land Grid Arrays

Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.

These new LGA products are the third low inductance family developed by AVX. The in-

novative LGA technology sets a new standard for low inductance MLCC performance.

Electronic Products awarded its 2006 Product of the Year Award to the LGA Decoupling

capacitor.

Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal

IDC low inductance MLCC with a number of advantages including:

• Simplified layout of 2 large solder pads compared to 8 small pads for IDCs

• Opportunity to reduce PCB or substrate contribution to system ESL by using multi-

ple parallel vias in solder pads

• Advanced FCT manufacturing process used to create uniformly flat terminations on

the capacitor that resist “tombstoning”

• Better solder joint reliability

APPLICATIONS

Semiconductor Packages

• Microprocessors/CPUs

• Graphics Processors/GPUs

• Chipsets

• FPGAs

• ASICs

Board Level Device Decoupling

• Frequencies of 300 MHz or more

• ICs drawing 15W or more

• Low voltages

• High speed buses

0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC

0.1

0.01

0.001

100

1000

Frequency (MHz)

LGA Low Inductance Capacitors

0204/0306/0805 Land Grid Arrays

SIZE

LG12 (0204)

0.50 (0.020)

1.00 (0.039)

X7S (Z)

LG22 (0306)

0.76 (0.030)

1.60 (0.063)

LGC2 (0805)

2.06 (0.081)

1.32 (0.052)

Length

Width

mm (in.)

Temp. Char.

Working Voltage

X5R (D)

X6S (W)

X7R (C)

X5R (D)

6.3

(6)

X7S (Z)

X6S (W)

X7R (C)

X5R (D)

X7S (Z)

X6S (W)

6.3

(6)

(4)

6.3

(6)

(4)

6.3

(4)

(Z)

6.3

(6)

(4)

6.3

(6)

(4)

6.3

(6)

(4)

6.3

(6)

(4)

6.3

(6)

(4)

6.3

(6)

(4)

6.3

(6)

(4)

(6)

Cap (μF)

0.010 (103)

0.022 (223)

0.047 (473)

0.100 (104)

0.220 (224)

0.330 (334)

0.470 (474)

1.000 (105)

2.200 (225)

Please

contact AVX

for values

= X7R

= X5R

= X7S

= X6S

HOW TO ORDER

104

Style Case Number of Working Temperature Coded

Cap

Termination Termination Packaging

Thickness

Number of

Size

Terminals Voltage Characteristic Cap Tolerance

Style

100% Sn*

Tape & Reel S = 0.55mm Capacitors

1 = 0204

2 = 0306

4 = 4V

6 = 6.3V

Z = 10V

C = X7R

D = X5R

Z = X7S

W = X6S

M = 20% A = “U” Land

2 = 7" Reel

max

*Contact factory for

other termination

finishes

4 = 13" Reel

= 0805

Reverse

Geometry LGA

LG12, LG22

Standard

Geometry LGA

LGC2

PART DIMENSIONS

mm (inches)

Series

0.5 0.05

(0.020 0.002)

1.00 0.10

(0.039 0.004)

0.50 0.05

(0.020 0.002)

0.8 0.10

(0.031 0.004)

0.13 0.08

(0.005 0.003)

LG12 (0204)

0.76 0.10

(0.030 0.004)

1.60 0.10

(0.063 0.004)

0.50 0.05

(0.020 0.002)

1.50 0.10

(0.059 0.004)

0.28 0.08

(0.011 0.003)

LG22 (0306)

LGC2 (0805)

2.06 0.10

(0.081 0.004)

1.32 0.10

(0.052 0.004)

0.50 0.05

(0.020 0.002)

1.14 0.10

(0.045 0.004)

0.90 0.08

(0.035 0.003)

RECOMMENDED SOLDER PAD DIMENSIONS mm (inches)

Series

PW1

LG12 (0204)

LG22 (0306)

LGC2 (0805)

0.50 (0.020)

0.65 (0.026)

1.25 (0.049)

1.00 (0.039)

1.50 (0.059)

1.40 (0.055)

0.20 (0.008)

PW1

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